SIP: A System in Package is a number of miniature integrated circuits and other electronic components incorporated in a single package. It performs the operations performed by an IC or other passive electronic components.
The SIP is typically introduced in electronic devices such as mobile phones, remotes and more. The fine architecture of an SIP is crafted using a technology termed as flip chip technology. Soldering or solder bumping to be precise is also a part of this process. An SIP may contain IC of similar or dissimilar functionalities.
The main focus of an SIP is to integrate multiple electronic components and ICs into a small miniaturised package and thus reducing size and cost while increasing efficiency. Horizontal tiling and vertical stacking are procedures used for the placement of bare die containing integrated circuits (IC) or chips.
During the making of an SIP, factors such as elements being used for the packaging process, as well the design approach is to be considered. A design basically outlines the method to integrate miniature components on to a single chip. A design is also needed as per the needs of manufacturing requirements.
SIP manages to interconnect the dies with its appropriate chip wire bonds or soldering bumps. There are multiple 3D packaging techniques that are used as per industry standards to integrate as many chips as possible onto a single bare die thus reducing an entire circuitry to a very much compact and small area.
A type of an SIP package is SIP-LGA, or System in Package Line Grid Array, which is plastic board that allows soldering of multiple components onto it with interconnection terminals beneath it. It can potentially include passive devices such as resistors, transistors or even multiple die.
A SIP has multiple advantages which include high flexibility for incorporating more and more, reduced manufacturing and R&D costs, faster time to produce and a lot more. It most significantly reduces the cost for assembling multiple electronics components or dies or ICs into a single equipped package. It is one of the fastest evolving packaging technologies in the world. An SIP has very few external connections or soldering joints sticking out of the package designed for totally extreme conditions.
Some of the standard packaging types are Ball Grid Array (BGA), Pin Grid Array (PGA), Surface mount package. Many criteria needs to be met before packaging multiple components and the most important of them are thermal issues. Higher the number of integrations more is the more will be the heating problems. To tackle these challenges thermal enhancement options are applied in order to sustain the components while making it feasible. The demand for an SIP increases with decrease in its size. As smaller the size more is its applications.
A sample SIP may contain a DRAM, memory and a processor simultaneously with passive elements such as resistors and capacitors, all of them being mounted on the same flat package surface. Thus it reduces the need to add fewer external attachments for a device to completely function adding to its advantage. High quality SIPs are rugged proof, shiny, flat and even surfaces to add to the overall design and fabrication of the SIP.
The beauty of an SIP is in its incorporation of an entire circuitry in on a flat bare die or a stack which is particularly useful in the modern world of consumer electronics today.