MCP: is an abbreviated term for Multi Chip Packages. This term is more commonly known to the people in general as MCM which stands for Multi Chip Modules. Multi Chip is a form of packaging that places a maximum number of 5 chips besides each other on a substrate layer by the use of wire bonds.
The chips are usually placed in a multi-layer circuit. The chip protection relies upon a plastic encapsulation or inexpensive packages made of ceramic. Connection and communications between layers is achieved via wire bonding.

A Multi Chip Packaging incorporates all the chips into one single module and packages them to functions as one single chip. Board assembly operations remain the same for the assembling process of all the chips. Hybrid Integrated Circuit is another term for MCP. Passive electronic components such as resistors can also be used and mounted on to a Multi-Chip Packaging. The most significant feature of an MCP is the use of one MCP facilitates the functioning of multiple applications. Thus incorporation of an MCP becomes easy as all the necessary components are pre-mounted on to it.

Multi Chip Packages are available in several different types as per industry standards and requirements. These types of MCP are designed based on various design, functionality or complexity criteria. A Multi Chip Package imitates an entire package consisting of multiple integrated circuits packed together to by a circuitry on a flat PCB to perform a specific task. It can also mimic the functions of a fully designed chip module placed on flat substrate. Multi Chip Module is an important part of the miniaturization of electronic devices in the modern world. It acts as a very high density substrate that has several interconnections by means of wire bonding.

MCM-L, MCM-D, MCM-C are a few types of Multi Chip Packages. The L, D and C in the previous statement stands for laminated, deposited and ceramic substrate respectively. Chip Stack MCM is the latest avatar of MCMs. It is designed based on the concept of "Chip Stack" packaging. The philosophy behind a Chip Stack MCM lies in the fact that certain ICs have a very much identical leads that are made use of during interconnection. A precisely crafted substrate of an MCP can allow these ICs to be placed vertically thus reducing the overall size by a lot and minimizing the complete footprint of the package substantially. A micro SD external memory card may contain as many as 10 thinned substrate layers.

There are many advantages to a Multi-Chip Package. A few are listed below. It reduces the cost of production very significantly as it reduces the number of chips and leads used. It has a very steady and low power consumption rating. It provides very high performance and efficiency as close packing of dies increases connectivity and reduces transfer time. Chips made out of different technologies along with other components can be moulded and mounted on to the same chip.

The market for Multi Chip Packaging is vast and ever growing as packing several chips into one package provides a very high performance and this high performance need is a must in the modern world of expanding electronic technology. It finds several applications in packaging and chip integration areas where the designers and makers consider it as the "Holy Grail" of packaging techniques.